| 王旭,李鑫,邱名健,倪一鸣,刘明仁,张栋梁,赵延,周薇,王觅堂.纳米CeO2磨料在化学机械抛光中的研究进展[J].有色金属材料与工程,2025,46(2):1-8. |
| 纳米CeO2磨料在化学机械抛光中的研究进展 |
| Research progress on nano-CeO2 abrasive in chemical mechanical polishing |
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| DOI：10.13258/j.cnki.nmme.20250312001 |
| 中文关键词: 化学机械抛光 纳米CeO2磨料 合成方法 性质调控 作用机制 |
| 英文关键词:chemical mechanical polishing nano-CeO2 abrasive synthesis methods property regulation action mechanism |
| 基金项目:国家重点研发计划资助项目（2023YFB3507100）；内蒙古自治区科技重大专项（2019ZD023；2021ZD0028） |
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| 中文摘要: |
| 化学机械抛光（chemical mechanical polishing，CMP）是集成电路制造中实现全局平坦化的核心工艺，而纳米CeO2因其较高的材料去除率、较低的表面损伤及高选择性成为CMP领域的关键磨料之一。综述了纳米CeO2磨料的合成方法、性质调控及其对抛光性能的影响和作用机制。在合成方法中，水热法、沉淀法、溶胶-凝胶法均可通过控制合成条件制备出粒径均匀、团聚较少的纳米CeO2磨料。纳米CeO2磨料的粒径通过多种作用协同影响抛光效率，而形貌与结构对表面粗糙度及划痕深度产生显著影响。通过对纳米CeO2磨料进行掺杂或还原处理以提高Ce3+浓度，可增强其化学活性并改善其抛光性能。对作用机制的分析表明，纳米CeO2磨料通过形成Ce―O―Si键以促进硅基材料表面水解和生成软质层，并通过机械研磨实现高效平坦化。 |
| 英文摘要: |
| Chemical mechanical polishing (CMP) is the core process for achieving global planarization in integrated circuit manufacturing, and nano-CeO2 has become one of the key abrasives in the CMP field due to its high material removal rate, low surface damage, and high selectivity. The synthesis methods, property regulation, the influences on polishing performance and action mechanism of nano-CeO2 abrasives were reviewed. In synthesis methods, hydrothermal synthesis method, precipitation method, and sol-gel method can all prepare nano-CeO2 abrasives with uniform particle sizes and less agglomeration by controlling synthesis conditions. The particle size of nano-CeO2 abrasives synergistically affects the polishing efficiency through multiple effects, while morphology and structure have significant effects on the surface roughness and scratch depth. Increasing the concentration of Ce3+ of the nano-CeO2 abrasives by doping or reduction treatment can enhance their chemical activity and improve the polishing performance. The analysis of the action mechanism indicates that the nano-CeO2 abrasive promotes the hydrolysis of silicon-based material surfaces to generate a soft layer by forming Ce―O―Si bonds, and achieves efficient planarization through mechanical grinding. |
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