期刊信息
  • 主管单位:
  • 上海市科学技术协会
  • 主办单位:
  • 上海有色金属学会
    上海理工大学
  • 名誉主编:
  • 陈兴章
  • 主    编:
  • 刘平
  • 地    址:
  • 上海市军工路516号
  • 邮政编码:
  • 200093
  • 联系电话:
  • (86)021-55781550
  • 电子邮件:
  • nmme@usst.edu.cn
  • 国际标准刊号:
  • 2096-2983
  • 国内统一刊号:
  • 31-2125/TF
  • 单    价:
  • 8.00
  • 定    价:
  • 60.00
李帅帅,彭奇珍,张然,李强.沉积温度对纯钛表面制备Cu掺杂羟基磷灰石涂层的影响[J].有色金属材料与工程,2023,44(5):16-21.
沉积温度对纯钛表面制备Cu掺杂羟基磷灰石涂层的影响
Effect of deposition temperature on preparation of Cu-doped hydroxyapatite coating on pure titanium
  
DOI:10.13258/j.cnki.nmme.2023.05.003
中文关键词:  电化学沉积  纯钛  Cu掺杂  羟基磷灰石
英文关键词:electrochemical deposition  pure titanium  Cu doping  hydroxyapatite
基金项目:上海市自然科学基金资助项目(15ZR1428400);上海高性能医疗器械材料工程技术研究中心资助项目(20DZ2255500)
作者单位E-mail
李帅帅 上海理工大学 机械工程学院, 上海 200093  
彭奇珍 上海理工大学 机械工程学院, 上海 200093  
张然 上海理工大学 机械工程学院, 上海 200093  
李强 上海理工大学 机械工程学院, 上海 200093
上海高性能医疗器械材料工程技术研究中心, 上海 200093 
liqiang@usst.edu.cn 
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中文摘要:
      在钛和钛合金表面制备羟基磷灰石(hydroxyapatite, HAp)涂层能够显著提升其生物活性。HAp中进一步掺杂Cu,可以获得抗菌效果,有效避免术后感染。为研究温度对纯钛表面制备Cu掺杂羟基磷灰石(CuHAp)涂层形貌的影响,采用电化学沉积的方法,在不同温度下制备CuHAp涂层。采用扫描电子显微镜、能量色散X射线光谱仪、X射线衍射仪对涂层的表面形貌、元素含量和物相组成进行表征。结果表明:随着沉积温度的升高,沉积过程中的电流密度也随之增大。沉积温度由25 ℃升高至45 ℃,会加快CuHAp涂层致密均匀的生长;但温度升高到55 ℃时,CuHAp涂层变得疏松,并且出现裂纹。沉积温度低于45 ℃时,Ca+Cu与P的物质的量比小于1.67,有利于骨生长。适当提高沉积温度,可以得到均匀致密的CuHAp涂层。
英文摘要:
      Preparing hydroxyapatite (HAp) coating on the surface of titanium and titanium alloys can significantly improve their biological activity. Further doping copper in HAp can achieve antibacterial effect and effectively avoid postoperative infection. In order to study the effect of temperature on the morphology of Cu-doped hydroxyapatite (CuHAp) coating prepared on pure titanium surface, the CuHAp coatings were prepared by electrochemical deposition at different temperatures. The surface morphology, element content and phase composition of the coating were characterized by scanning electron microscope, energy dispersive X-ray spectrometer, and X-ray diffractometer. The results show that the current density increases with the increase of temperature. Increasing the deposition temperature from 25 °C to 45 °C accelerates the dense and uniform growth of CuHAp coating. However, when the temperature is raised to 55 °C, CuHAp coating becomes loose, and cracks appear. When the deposition temperature is lower than 45 °C, the amount of substance ratio of (Ca+Cu)/P is less than 1.67, which is beneficial for bone growth. A uniform and dense CuHAp bioactive coating can be obtained by properly raising the deposition temperature.
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