| 赵玉萍,霍飞.温度与镀层对Sn0.7Cu焊料合金润湿性的影响[J].有色金属材料与工程,2015,36(2):65-70. |
| 温度与镀层对Sn0.7Cu焊料合金润湿性的影响 |
| Wetting of Sn-0.7Cu Solder Alloy on Different Substrates at Different Temperatures |
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| DOI：10.13258/j.cnki.snm.2015.02.005 |
| 中文关键词: Sn-0.7Cu焊料合金 表面张力 润湿性 |
| 英文关键词:Sn-0.7Cu solder alloy surface tension wettability |
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| 中文摘要: |
| 主要研究了真空状态下,焊接温度为530,560和590 K时,Sn-0.7Cu焊料合金在镀Cu、镀Ni、镀Ni/Ag和镀Ni/Au基板上的润湿性.结果表明:提高钎焊时的焊接温度,有助于降低液态Sn-0.7Cu焊料合金的表面张力,从而增大Sn-0.7Cu焊料合金在焊接基板上的润湿性.在相同的焊接条件下,Sn-0.7Cu焊料合金在镀Ni/Ag和镀Ni/Au基板上的润湿性比其在Cu和镀Ni基板上的润湿性好. |
| 英文摘要: |
| In this paper,the wettability of Sn-0.7Cu solder alloy was investigated on different substrates(Cu,Cu/Ni,Cu/Ni/Au and Cu/Ni/Ag)at different temperatures(530 K,560 K and 590 K respectively).The results show that the wettability of Sn-0.7Cu solder alloy improved due to the increase of reflowing temperature which decreased surface tension of molten Sn-0.7Cu alloy.In addition,in the same soldering conditions Sn-0.7Cu solder alloy had better wettability on Cu/Ni/Au and Cu/Ni/Ag substrates than that on Cu and Cu/Ni substrates. |
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