| 孙建新,张成林,罗贤.高导热金刚石/Cu复合材料的研究进展[J].有色金属材料与工程,2024,45(4):1-11. |
| 高导热金刚石/Cu复合材料的研究进展 |
| Research progress of high thermal conductivity diamond/Cu composites |
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| DOI：10.13258/j.cnki.nmme.20240422002 |
| 中文关键词: 金刚石/Cu复合材料 热导率 制备技术 界面改性 |
| 英文关键词:diamond/Cu composites thermal conductivity preparation technique interfacial modification |
| 基金项目:重庆市自然科学基金资助项目（CSTB2022NSCQ-MSX1193） |
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| 中文摘要: |
| 随着大数据、人工智能等信息技术的飞速发展，电子元器件逐渐向便携、轻量、高性能等方向发展。金刚石/Cu复合材料具有热导率高、热膨胀系数与电子元器件匹配度高等优点，目前已成为第三代先进电子封装材料。综述了国内外金刚石/Cu复合材料的制备方法、影响金刚石/Cu复合材料热导率的因素，尤其是界面改性对热导率的影响。此外，还对金刚石/Cu复合材料的未来发展方向进行了预测，为金刚石/Cu复合材料的研制提供参考。 |
| 英文摘要: |
| With the rapid development of information technology such as big data and artificial intelligence, electronic components are advancing gradually toward the direction of portability, light weight and high performance. Diamond/Cu composites have become the mainstream third-generation advanced electronic packaging materials due to the advantages of high thermal conductivity, high compatibility with electronic components in terms of thermal expansion coefficient. The preparation methods of diamond/Cu composites, the influencing factors of thermal conductivity, especially the influence of interface modification on thermal conductivity were reviewed at home and abroad. In addition, the future development directions of diamond/Cu composites were predicted in this paper, which provides guidance for the future research of diamond/Cu composites. |
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