| 宗豪,刘新宽,刘实.氢化膜对钛表面电镀镀层结合的影响[J].有色金属材料与工程,2024,45(6):86-93. |
| 氢化膜对钛表面电镀镀层结合的影响 |
| Effect of hydrogenation films on the bonding of electroplating coatings on titanium surface |
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| DOI：10.13258/j.cnki.nmme.20240127001 |
| 中文关键词: 钛；电镀 氢化膜 镀层结合强度 中空镀层 |
| 英文关键词:titanium electroplating hydrogenated film bonding strength of the plating layer hollow plateing layer |
| 基金项目:国家自然科学基金资助项目（51771119） |
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| 摘要点击次数: 2 |
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| 中文摘要: |
| 通过扫描电子显微镜（scanning electron microscope，SEM）、X射线衍射仪（X-ray diffractometer，XRD）、能谱仪（energy dispersive spectrometer，EDS）研究了氢化膜对钛表面电镀镀层结合的影响。试验结果表明：钛经过HCl和H2SO4混合溶液的氢化处理，一方面可以实现钛基体上电镀镍铜，提高镀层结合强度，镀层结合强度最大值为9.6 MPa；但另一方面氢化形成蜂窝状多孔的氢化膜会限制镀层结合强度。多孔氢化膜会导致电镀产生中空多孔的镀层，也会使氢化产生的杂质残留在孔内无法排出；再者，多孔氢化膜的强度不高，这些因素都会影响镀层和基体的结合，在一定程度上限制了镀层结合强度的提高。 |
| 英文摘要: |
| The effect of hydrogenated film on the bonding of titanium surface electroplating layer was investigated by scanning electron microscope (SEM), X-ray diffractometer (XRD) and energy dispersive spectrometer (EDS). The experimental results show that titanium hydrogenated with a mixture of hydrochloric acid and sulfuric acid, on the one hand, can realize nickel-copper plating on titanium substrate, which improves the bonding strength of the plating layer, and the maximum bonding strength of the plating layer is 9.6 MPa; however, on the other hand, the formation of honeycomb-like porous hydrogenated film can limit the bonding strength of the plating layer. The porous hydrogenated film not only causes a hollow and porous plating layer, but also stops the removal of the impurities generated by hydrogenation from the holes, furthermore, the porous hydrogenated film is not strong, and all these factors affect the bonding between the plating layer and the substrate, which limits the improvement of the bonding strength of the plating layer to some extent. |
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