| 陈剑明,张建波,李明茂.Sn-Bi系低温无Pb焊料的研究现状及发展趋势[J].有色金属材料与工程,2017,38(2):112-118. |
| Sn-Bi系低温无Pb焊料的研究现状及发展趋势 |
| Review of Sn-Bi Low Temperature Lead-free Solder |
| |
| DOI：10.13258/j.cnki.nmme.2017.02.011 |
| 中文关键词: Sn-Bi焊料 无Pb焊料 结构转变 润湿性能 界面化合物 |
| 英文关键词:Sn-Bi solder lead-free solder structure transition wetting properties interfacial compounds |
| 基金项目:江西省科技自然科学基金项目（20142BAB206013） |
|
| 摘要点击次数: 3447 |
| 全文下载次数: 1376 |
| 中文摘要: |
| 低熔点Sn-Bi焊料是比较有发展潜力的低温无Pb焊料.根据Sn-Bi焊料的特性及其应用存在的问题，结合近几年国内外对Sn-Bi系低温无Pb焊料的最新研究成果，综述了Sn-Bi无Pb焊料的温度诱导熔体结构转变现象及其对Sn-Bi焊料凝固组织的影响，介绍了合金元素及稀土元素的添加对Sn-Bi焊料润湿性能的影响及其影响机制，并分类总结了不同元素对Sn-Bi焊料与Cu基体界面化合物生长的促进与抑制作用及其原理，最后综合评述Sn-Bi低温无Pb焊料存在的问题，对Sn-Bi焊料的发展趋势进行了展望. |
| 英文摘要: |
| With low melting point,Sn-Bi solder has a prospective application as low temperature lead-free solder.This paper reviews the phenomenon of the temperature induced melting structure transition in Sn-Bi lead-free solder and its effect on solidified microstructure of Sn-Bi solder.This work is based on the characteristics and issues in application of Sn-Bi solder,combing with recent research in Sn-Bi low-temperature solder field at home and abroad.Firstly,the effect of alloy element and rare earth element on wetting property of Sn-Bi solder and the related mechanism were introduced.Secondly,the enhancement or degradation of interfacial compounds growth of Sn-Bi solder and Cu substrate by using different element were classified and summarized.Finally,we comprehensively analyzed the existing challenge on Sn-Bi low temperature lead-free solder and also outlooked the prospect of development trend in Sn-Bi solder. |
| HTML 查看全文 查看/发表评论 下载PDF阅读器 |
