| 黄震,张华.半导体制冷技术的研究现状及发展方向[J].有色金属材料与工程,2017,38(2):106-111. |
| 半导体制冷技术的研究现状及发展方向 |
| Reviews of Semiconductor Refrigeration Technology |
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| DOI：10.13258/j.cnki.nmme.2017.02.010 |
| 中文关键词: 半导体制冷 热电材料 优值系数 结构 散热 |
| 英文关键词:semiconductor refrigeration thermoelectric material figure of merit structure heat-dissipating |
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| 摘要点击次数: 6807 |
| 全文下载次数: 4370 |
| 中文摘要: |
| 半导体制冷技术是一门以热电制冷材料为基础的新兴制冷技术.通过阅读大量文献，从热电材料、结构设计、冷热端散热方式3个方面对半导体制冷技术近年来的研究热点和成就进行了总结和论述，并指出了半导体制冷技术的发展方向.热电材料决定了优值系数Z，可以从根本上提高材料的制冷性能，但研究难度较大，发展缓慢；优化结构设计可以有效地提高制冷单元的实际性能系数，重点在于优化尺寸因子G和热电阻，缺点是实际加工工艺复杂；减小热电偶冷热端的温差有利于提高制冷量，可以大幅提高制冷系数，有效的散热方式是提高半导体制冷效率的重要因素. |
| 英文摘要: |
| The semiconductor refrigeration technology is a new refrigeration technology based on the thermoelectric refrigeration material.This article summarizes and discusses the research of hotspots and achievements of semiconductor refrigeration technology in recent years,from the aspects of thermoelectric materials,structural design and heat dissipation way,and also outlooks the development trend of semiconductor refrigeration technology.It is found that thermoelectric material faces difficulty in development due to the challenge of increasing the figure of merit Z,which can decide the refrigeration performance fundamentally.Although the optimized structural design(size factor and thermal resistance) can improve the actual performance coefficient of refrigeration units,the processing technic is too complicated.By reducing the temperature difference between the hot and cold side of thermocouple,the refrigeration coefficient was improved.And the effective heat-dissipating method is a key factor to improve the refrigeration efficiency of semiconductor. |
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